In a groundbreaking move for India’s semiconductor sector, RRP Electronics, backed by cricketing legend Sachin Tendulkar, has forged a strategic alliance with US-based Deca Technologies, Inc. to supercharge its wafer-level packaging capabilities. This partnership marks a significant milestone in India’s journey to becoming a global semiconductor powerhouse.

Under this collaboration, RRP Electronics-renowned for its expertise in assembling and testing semiconductor components-will integrate Deca’s cutting-edge Wafer-Level Chip Scale Packaging (WLCSP) and M-Series™️Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes. This will elevate the company’s ability to deliver high-performance semiconductor solutions to customers worldwide.