The proposals have been approved under the India Semiconductor Mission, which has an outlay of Rs 76,000 crore to provide financial support for setting up chip facilities in the country
Cabinet has approved four semiconductor plants that will be set up in Odisha, Punjab and Andhra Pradesh, Union Minister Ashwini Vaishnaw said. File Pic
The Union Cabinet has approved four semiconductor projects for Odisha, Punjab and Andhra Pradesh, Information & Broadcasting Minister Ashwini Vaishnaw said on Tuesday, reported the PTI.
The proposals have been approved under the India Semiconductor Mission, which has an outlay of Rs 76,000 crore to provide financial support for setting up chip facilities in the country.
"Cabinet has approved four semiconductor plants that will be set up in Odisha, Punjab and Andhra Pradesh," Vaishnaw said, according to the PTI.
The minister said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem Pvt Ltd. Another plant in the state will be set up for 3D Glass manufacturing with an investment of Rs 1,943 crore.
The minister said that the 3D Glass semiconductor plant will be backed by investment from leading US technology firm Intel, Lockheed Martin, etc.
The Cabinet approved a chip packaging plant in Andhra Pradesh, which will be set up by Advanced System in Package Technologies Pvt Ltd with an investment of Rs 468 crore.
A semiconductor project of electronic component maker firm CDIL, to be set up in Punjab with an investment of Rs 117 crore, has been approved, the minister stated, the news agency reported.
SiCSem Private Limited will set up the country's first commercial compound semiconductor fabrication facility, capable of producing 60,000 wafers annually and packaging 96 million units. The plant's products will cater to applications in electric vehicles, railways, fast chargers, data centres, solar inverters, consumer appliances and missile systems, the ANI reported.
The second Odisha project, by 3D Glass Solutions Inc. (3DGS), will establish an advanced packaging and embedded glass substrate facility. It will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units and 13,200 3D Heterogeneous Integration (3DHI) modules. The technology will be used in high-performance computing, artificial intelligence, defence electronics, radio frequency and photonics applications.
In Andhra Pradesh, Advanced System in Package (ASIP) Technologies, in collaboration with South Korea's APACT Co. Ltd., will set up a semiconductor manufacturing unit with a capacity of 96 million units a year. The plant will serve markets for mobile devices, set-top boxes, automotive electronics and other applications.The fourth project that was approved by the Union Cabinet is for Continental Device India Ltd. (CDIL) in Mohali, Punjab, it will expand the company's discrete semiconductor manufacturing capacity. The upgraded facility will produce 158.38 million units of high-power devices annually, including MOSFETs, IGBTs, Schottky diodes and transistors in both silicon and silicon carbide. These components are used in EV electronics, renewable energy systems, power conversion, industrial automation and communication infrastructure.
"These projects will accelerate our journey towards Atmanirbhar Bharat in electronics manufacturing and create a talent pool that will serve global industry," the government said in a statement.
(with PTI and ANI inputs)
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