Researchers from The University of Texas at Dallas and Seoul National University have developed an innovative imager chip inspired by Superman’s X-ray vision. This could enable mobile devices to detect objects inside packages or behind walls.

The chip, designed for handheld devices, can find studs, beams, wiring, pipe cracks, or envelope contents. Potential medical applications are also being explored. The research, published in IEEE Transactions on Terahertz Science & Technology, showcases advancements that make the technology compact and high-quality.