Odisha: India’s first 3D glass chip packaging unit launched in Bhubaneswar

The glass chip unit was unveiled in Odisha. Pic/PTI

Odisha Chief Minister Mohan Charan Majhi and Union minister Ashwini Vaishnaw on Sunday launched India's first advanced 3D glass chip packaging unit in Bhubaneswar, an official said.

Majhi, along with Vaishnaw, the Union Railways, Information and Broadcasting, and Electronics and Information Technology Minister, laid the foundation stone.

Majhi said Odisha's industrial landscape is evolving rapidly, no longer anchored solely to traditional sectors, but boldly embracing technology, innovation, and high-value manufacturing.

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